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ics for communications mixer pmb 2331 version 1.2 preliminary data sheet 09.97 t2331-xv12-p2-7600
edition 09.97 published by siemens ag, bereich halbleiter, marketing- kommunikation, balanstra?e 73, 81541 mnchen ? siemens ag 1995. all rights reserved. attention please! as far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. the information describes the type of compo- nent and shall not be considered as assured characteristics. terms of delivery and rights to change design reserved. for questions on technology, delivery and prices please contact the semiconductor group offices in germany or the siemens companies and representatives worldwide (see address list). due to technical requirements components may contain dangerous substances. for infor- mation on the types in question please contact your nearest siemens office, semiconductor group. siemens ag is an approved cecc manufac- turer. packing please use the recycling operators known to you. we can also help you C get in touch with your nearest sales office. by agreement we will take packing material back, if it is sorted. you must bear the costs of transport. for packing material that is returned to us un- sorted or which we are not obliged to accept, we shall have to invoice you for any costs in- curred. components used in life-support devices or systems must be expressly authorized for such purpose! critical components 1 of the semiconductor group of siemens ag, may only be used in life-support devices or systems 2 with the ex- press written approval of the semiconductor group of siemens ag. 1 a critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effective- ness of that device or system. 2 life support devices or systems are intend- ed (a) to be implanted in the human body, or (b) to support and/or maintain and sus- tain human life. if they fail, it is reasonable to assume that the health of the user may be endangered. ausgabe 09.97 herausgegeben von siemens ag, bereich halbleiter, marketing- kommunikation, balanstra?e 73, 81541 mnchen ? siemens ag 1995. alle rechte vorbehalten. wichtige hinweise! gew?hr fr die freiheit von rechten dritter lei- sten wir nur fr bauelemente selbst, nicht fr anwendungen, verfahren und fr die in bau- elementen oder baugruppen realisierten schaltungen. mit den angaben werden die bauelemente spezifiziert, nicht eigenschaften zugesichert. lieferm?glichkeiten und technische ?nderun- gen vorbehalten. fragen ber technik, preise und lieferm?g- lichkeiten richten sie bitte an den ihnen n?chstgelegenen vertrieb halbleiter in deutschland oder an unsere landesgesell- schaften im ausland. bauelemente k?nnen aufgrund technischer erfordernisse gefahrstoffe enthalten. aus- knfte darber bitten wir unter angabe des be- treffenden typs ebenfalls ber den vertrieb halbleiter einzuholen. die siemens ag ist ein hersteller von cecc- qualifizierten produkten. verpackung bitte benutzen sie die ihnen bekannten ver- werter. wir helfen ihnen auch weiter C wenden sie sich an ihren fr sie zust?ndigen vertrieb halbleiter. nach rcksprache nehmen wir verpackungsmaterial sortiert zurck. die transportkosten mssen sie tragen. fr verpackungsmaterial, das unsortiert an uns zurckgeliefert wird oder fr das wir keine rcknahmepflicht haben, mssen wir ihnen die anfallenden kosten in rechnung stellen. bausteine in lebenserhaltenden ger?ten oder systemen mssen ausdrcklich dafr zugelassen sein! kritische bauelemente 1 des bereichs halblei- ter der siemens ag drfen nur mit ausdrckli- cher schriftlicher genehmigung des bereichs halbleiter der siemens ag in lebenserhalten- den ger?ten oder systemen 2 eingesetzt wer- den. 1 ein kritisches bauelement ist ein in einem lebenserhaltenden ger?t oder system ein- gesetztes bauelement, bei dessen ausfall berechtigter grund zur annahme besteht, da? das lebenserhaltende ger?t oder sy- stem ausf?llt bzw. dessen sicherheit oder wirksamkeit beeintr?chtigt wird. 2 lebenserhaltende ger?te und systeme sind (a) zur chirurgischen einpflanzung in den menschlichen k?rper gedacht, oder (b) untersttzen bzw. erhalten das menschli- che leben. sollten sie ausfallen, besteht berechtigter grund zur annahme, da? die gesundheit des anwenders gef?hrdet wer- den kann.
pmb 2331 revision history: current version: 09.97 previous version: 11.95 page (in 11.95 version) page (in 09.97 version) subjects (major changes since last revision) 10 10 supply voltage -> 5.0v max. 10 10 input voltage v lo/x -> 5.0v max. 10 10 open collector output voltage v mo/x -> 1.7v min. / 5.0v max. 10 esd integrity 21 21 general application
pmb 2331 table of contents page semiconductor group 4 09.97 1overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 1.1 functional description, benefits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 1.2 applications: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 1.3 pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 1.4 pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 1.5 functional block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 1.6 circuit description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 2.1 absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 2.2 operational range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 2.3 ac/dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 2.4 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 3 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
plastic package, p-dso-8-1 semiconductor group 5 09.97 mixer pmb 2331 version 1.2 bipolar ic 1overview 1.1 functional description, benefits ? new b6hf bipolar techology, 25ghz f t ? reduced external components ? frequency range up to 2.0 ghz ? 2.7-4.5v supply voltage ? mixer current adjustable with external resistors ? 1.6ma current consumption typical ( no external resistors used) ? -40c to +85c operational temperature range ? gilbert cell mixer ? very highly isolated rf, lo and if ports ? good crosstalk performance ? low noise ? low spurious signal content 1.2 applications: ? cellular radio mixer ? cordless telephone mixer ? uhf transceiver ? rf data links ? rf/vhf/uhf frequency conversion
pmb 2331 semiconductor group 6 09.97 1.3 pin configuration (top view) p-dso-8-1 1 2 3 4 5 6 7 8 mo mox v s mix mi gnd lo lox
pmb 2331 semiconductor group 7 09.97 1.4 pin definitions and functions pin no. symbol function 1 mo mixer signal output, open collector, not inverted 2 mox mixer signal output, open collector, inverted 3v s mixer voltage supply 4 lox mixer local oscillator signal base input, inverted 5 lo mixer local oscillator signal base input, not inverted 6 gnd mixer ground 7 mi mixer signal emitter input, not inverted 8 mix mixer signal emitter input, inverted
pmb 2331 semiconductor group 8 09.97 1.5 functional block diagram 8 7 6 5 1 4 3 2 bias v s lox mo mox gnd lo mix mi
pmb 2331 semiconductor group 9 09.97 1.6 circuit description the mixer used in this design is a general purpose up-/downconversion gilbert cell mixer. an amplified and filtered rf signal enters the ic via the pins mi/mix. using an external supplied local oscillator at lo/lox a converted output signal is created at the open collector output pins mo/mox, which have to be connected to an external voltage supply. the rf connections to the mixer inputs may be single ended or balanced, capacitive or inductive coupled. voltage supply for the mixer has to be connected to the pins v s and gnd. to increase the mixer current resistors need to be connected between the pins mi and gnd, and between the pins mix and gnd. differential signals and symmetrical circuits are used throughout the ic. an internal bias driver generates supply voltage and temperature compensated reference voltages. all pins with the exception of gnd are esd protected.
pmb 2331 semiconductor group 10 09.97 2 electrical characteristics 1) hbm according to mil-std 883d, methode 3015.7 2.1 absolute maximum ratings the maximum ratings may not be exceeded under any circumstances, not even momentarily and individually, as permanent damage to the ic will result. ambient temperature t amb = -40c...+85c # parameter symbol limit values units remarks min max 1 supply voltage v s -0.3 5.0 v 2a input voltage mi/mix v mi/mix -0.3 1.9 v v s = 0v 2b input voltage lo/lox v lo/lox 0.6 v s +0.3 5.0 max. v v 3 open collector output voltage v mo/mox 1.7 v s +0.3 5.0 max. v v 4 differential input voltage v d iff 2.0 v pp 5 junction temperature t j 125 c 6 storage temperature t s -40 125 c 7 thermal resistance r thja 185 k/w 8 esd integrity v esd -1000 1000 v 1)
pmb 2331 semiconductor group 11 09.97 2.2 operational range within the operational range the ic operates as described in the circuit description. the ac/dc characteristic limits are not guaranteed. supply voltage v vcc = 2.7v...4.5v, ambient temperature t amb = -40c...85c note: power levels refer to 50 ohms impedance # parameter symbol limit values units remarks min max 1 mi/x input frequency f mi 2000 mhz 2 lo/x input frequency f lo 2000 mhz 3 if intermediate frequency f if 2000 mhz
pmb 2331 semiconductor group 12 09.97 2.3 ac/dc characteristics ac/dc characteristics involve the spread of values guaranteed within the specified supply voltage and ambient temperature range. typical characteristics are the median of the production. supply voltage v vcc = 2.7v...4.5v, ambient temperature t amb = +25c *minimum value for r1=r2=33ohm **matching network used ***referenced for specified mixer performance # parameter symbol limit values units test conditions test circuit min typ max supply current 1 supply current, total ic i 1,2,3 1.6 ma without external resistors r1,2 1a,b 2 supply current, total ic i 1,2,3 4.6 ma including ex- ternal resistors r1,2 *(=180 w) 1a,b mixer, signal input mi/mix, down conversion, r 1,2 = 180 ohm 3 input impedance s 11m diagram 2a 4 max. input level, 1 db comp. at mo/mox, if=45mhz p mi -16 dbm f=0.9ghz 1a 5 input intercept point, d f=800khz, if= 45mhz iicp3 mi -2 dbm f=0.9ghz 1a 6 blocking level d f=800khz, if= 45mhz p bl -16 dbm f=0.9ghz 1a 7 noise figure, ssb, (nf ssb ? nf dsb + 3db) if = 45mhz f mi 9.5 db f=0.9ghz ** 1a mixer, local oscillator input lo/lox 8 input impedance s 11lo diagram 2b 9 input level p lo -3 dbm f=0.9ghz, *** 1a,b
pmb 2331 semiconductor group 13 09.97 ac/dc characteristics ac/dc characteristics involve the spread of values guaranteed within the specified supply voltage and ambient temperature range. typical characteristics are the median of the production. supply voltage v vcc = 2.7v to 4.5v, ambient temperature t amb = +25 # parameter symbol limit values unit test conditions test circuit min typ max mixer, signal output mo/mox, down conversion, r 1,2 = 180 ohm 10 output current i mo+ mox 4.0 ma including ex- ternal resi- stors r1, r2 1a,b 11 output resistance r modiff 38 kohm if=45mhz 1a 12 output resistance r modiff 24 kohm if=300mhz 1b 13 output capacitance c modiff 0.34 pf if=45mhz 1a 14 output capacitance c modiff 0.38 pf if=300mhz 1b 15 power gain, if=45mhz p mi 14 db f=0.9ghz 1a 16 power gain, if=300mhz p mi 7dbf=0.9ghz1b mixer, isolation between in-/output, 0.9ghz 17 mi to mo a mi-mo 30 db f mi =945mhz f lo =900mhz 1a 18 lo to mo a lo-mo 50 db 1a 19 lo to mi a lo-mi 50 db 1a 20 mo to mi a mo-mi 50 db 1a 21 mo to lo a mo-lo 60 db 1a
pmb 2331 semiconductor group 14 09.97 2.4 test circuits test circuit 1a test circuit for 45 mhz intermediate frequency test circuit f if [mhz] c b [pf] c k [pf] x 1a 45 15p/100p 15p x 180 180 c k pmb 2331 5 4 v cc to k o balun 1:1 to k o balun 1:2 v cc c k c k c k c b mi input lo input c b =20:2 vogt transformer kit, 0.05mm wire =20:2 toko balun =1:1 ? 617db-1023 =1:2 ? 617db-1016 mo output 1 8
pmb 2331 semiconductor group 15 09.97 test circuit 1b test circuit for 300 mhz intermediate frequency test circuit f if [mhz] l0[nh] l1[nh] c1[pf] c2[pf] c3[pf] c k [pf] 1b ? 300 680 150 2.7 12 1.8 15p 180 180 c2 c k pmb 2331 5 4 v cc to k o balun 1:1 to k o - balun 1:2 v cc c k c k c k c b c1 c3 mi input lo input mo output c b l1 l0 toko balun =1:1 ? 617db-1023 =1:2 ? 617db-1016 8 1
pmb 2331 semiconductor group 16 09.97 test circuit 2 s-parameter measurement of mixer s11, s12, s21, s2 the s-parameters are tested at the indicated frequency and the equivalent parallel or series circuit is calculated on this base. via the nwa the capacitive coupling is done and the open collector pins are connected to vcc. the output levels at port1 and 2 for pin x and y are -30dbm for mi and mo- impedances and -5dbm for the lo impedance.s-parameters have to be considered as design hints and are measured with siemens testboards. (rt/duroid 5880 teflon, e=2.2) test test frequency [ghz] pin x pin y lo-input impedance .. - 3.0 4 5 mi-input impedance .. - 3.0 7 8 mo-output impedance .. - 3.0 1 2 network analyzer z l =50ohm pin y port 1 port 2 dut pin x
pmb 2331 semiconductor group 17 09.97 test circuit 2a mixer input impedance measurement test circuit 2b mixer local oscilllator impedance measurement nw mi mix mo mox lo lox r r dc supply 50 w 50 w 33p 33p 50 w p1 p2 v s stb dut dc supply 1:2 mi mix mo mox lo lox p2 nwa 5,6p 5,6p 5,6p 15n r r 10p 10p 15n 680nh 1h v s stb dc supply 50 w dut 50 w 1:1
pmb 2331 semiconductor group 18 09.97 test circuit 2c mixer output impedance measurement mi mix mo mox lo lox dut r r 50 w 50 w p1 p2 nwa power supply 3.3v 10p 1n 100n v s stb 33p 33p internal bias tees 50 w 1:2
pmb 2331 semiconductor group 19 09.97 diagram 2a s-parameter mixer input mi impedance, i mo/mox = 4ma; f=..3ghz
pmb 2331 semiconductor group 20 09.97 diagram 2b s-parameter mixer input lo impedance, i mo/mox = 4ma; f=..3ghz
pmb 2331 semiconductor group 21 09.97 application circuit general applications refer to the pmb 2330 application note (different values)
pmb 2331 semiconductor group 22 09.97 3 package outlines plastic package, p-dso-8-1 (plastic dual small outline) sorts of packing package outlines for tubes, trays etc. are contained in our data book package information. dimensions in mm smd = surface mounted device

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